点击图片查看大图
星光850A恒温拆焊器
1) 旋转风专利手柄, 产生柔和均匀热风。优化直向加热的传统技术, 防止局部超高温而使线路板跷曲或BGA起泡等不良影响, 有效保护拆焊组件及线路板。
2) 采用非接触焊接技术, 可避免组件移位及热冲击。
3) 500W大功率快速升温。
4) 关机自动冷却保持发热组件更长寿。
5) 配长寿发热芯及24L大流量气泵。
6) 机顶把手方便移动。
7) 选配BGA风咀, 有效维修SMD/BGA。
== SUNKKO 850A ==
最高/稳定功率: 500W，300W
控温范围: 100~450 ℃
发热芯: 250W陶瓷
气泵: 45W膜片
气流量: 0.3~24公升/分钟
机身: 185(长)245(阔)170(高)毫米
包装: 33.5x28x19厘米
毛重: 4千克
SUNKKO 850A Rework Station
== FEATURE ==
1) Patent vortex handle provides even and soft hot air to have better protection of component and circuit board. It avoids PCB crooked or BGA blister from traditional technology of centralizing heating.
2) Non-touch soldering technique avoids component moving and heat shock.
3) 600W high power quick heat.
4) Auto cooling after power off keeps the heating parts long life.
5) Installed long life heater and 24L large air pump.
6) Carry handle is convenient to move.
7) Installed optional BGA nozzle achieves high efficiency for BGA repairing.
== SUNKKO 850A ==
Max/Steady Power:500W, 300W
Temperature: 100~450 oC
Heater: 250W Ceramic
Air Pump: 45W Diaphragm
Airflow: 0.3~24 L/min
Dimension: 185(L)245(W)170(H) mm
Packing: 33.5x28x19 cm
Gross Weight: 4 kg
